Semiconductor Engineering1d
Fine-Grained Functional Partitioning For Low Level SRAM Cache in 3D-IC designs (imec)
A new technical paper titled “Towards Fine-grained Partitioning of Low-level SRAM Caches for Emerging 3D-IC Designs” was ...
Semiconductor Engineering1d
Memristors: Flexible Behavioral Model ( Israel Institute of Technology)
A Compact Behavioral Model for Volatile Memristors” was published by researchers at Technion – Israel Institute of Technology ...
Semiconductor Engineering2d
Hardware Acceleration Approach for KAN Via Algorithm-Hardware Co-Design
A new technical paper titled “Hardware Acceleration of Kolmogorov-Arnold Network (KAN) for Lightweight Edge Inference” was ...
Semiconductor Engineering2d
Flexible IGZO RISC-V Microprocessor
A new technical paper titled “Bendable non-silicon RISC-V microprocessor” was published by researchers at Pragmatic Semiconductor, Qamcom,  and Harvard University. From the abstract: “Here we present ...
Semiconductor Engineering2d
Dualtronics: Photonic Devices on the Cation Face and Electronic Devices on the Anion Face of the Same Wafer
A new technical paper titled “Using both faces of polar semiconductor wafers for functional devices” was published by ...
Semiconductor Engineering2d
Using AI To Glue Disparate IC Ecosystem Data
Why the chip industry is so focused on large language models for designing and manufacturing chips, and what problems need to ...
Semiconductor Engineering2d
RAG-Enabled AI Stops Hallucinations, Adds Sources
For many use cases, fine-tuning is the last step in turning a foundation model into a specialist resource. However, to ensure ...
Semiconductor Engineering2d
Pressure Builds To Adopt Virtual Prototypes
Creating complex multi-chiplet systems is no longer a back-of-the-envelope diagram, but viable methodologies are still in ...
Semiconductor Engineering2d
Enabling Innovative Multi-Vendor Chiplet-Based Designs
The first, most well-proven, and obvious benefit of a chiplet-based approach is manufacturing cost. Manufacturing cost benefits are accrued either from the appropriate selection of chiplet die size, ...