Semiconductor Engineering1d
Fine-Grained Functional Partitioning For Low Level SRAM Cache in 3D-IC designs (imec)
A new technical paper titled “Towards Fine-grained Partitioning of Low-level SRAM Caches for Emerging 3D-IC Designs” was ...
Semiconductor Engineering1d
Memristors: Flexible Behavioral Model ( Israel Institute of Technology)
A Compact Behavioral Model for Volatile Memristors” was published by researchers at Technion – Israel Institute of Technology ...
Semiconductor Engineering2d
Dualtronics: Photonic Devices on the Cation Face and Electronic Devices on the Anion Face of the Same Wafer
A new technical paper titled “Using both faces of polar semiconductor wafers for functional devices” was published by ...
Semiconductor Engineering2d
Using AI To Glue Disparate IC Ecosystem Data
Why the chip industry is so focused on large language models for designing and manufacturing chips, and what problems need to ...
Semiconductor Engineering2d
Hardware Acceleration Approach for KAN Via Algorithm-Hardware Co-Design
A new technical paper titled “Hardware Acceleration of Kolmogorov-Arnold Network (KAN) for Lightweight Edge Inference” was ...
Semiconductor Engineering2d
Pressure Builds To Adopt Virtual Prototypes
Creating complex multi-chiplet systems is no longer a back-of-the-envelope diagram, but viable methodologies are still in ...
Semiconductor Engineering4d
Optimizing Wafer Edge Processes For Chip Stacking
Several critical processes address wafer flatness, wafer edge defects and what's needed to enable bonded wafer stacks.
Semiconductor Engineering5d
Models for Both Strained and Unstrained GAA FETs Using Neural Networks
A new technical paper titled “Impact of Strain on Sub-3 nm Gate-all-Around CMOS Logic Circuit Performance Using a Neural ...
Semiconductor Engineering5d
Characteristics and Potential HW Architectures for Neuro-Symbolic AI
A new technical paper titled “Towards Efficient Neuro-Symbolic AI: From Workload Characterization to Hardware Architecture” ...
Semiconductor Engineering4d
Research Bits: Sept. 24
“While experiments have shown devices can retain information for over 10 years, the models used in the community show that ...
Semiconductor Engineering9d
How Die Dimensions Challenge Assembly Processes
Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...
Semiconductor Engineering10d
What Comes After HBM For Chiplets
The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What ...