The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

It’s Singapore’s first facility dealing with HBM, part of the AI chips that are powering companies like Nvidia and TSMC to new heights.

The facility’s opening will bolster Micron’s technological edge and solidify SG’s position as a critical player in the global ...

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the company’s current facilities in Singapore. It marks Singapore’s first HBM ...

Micron plans to invest around $7 billion over the next five years to boost memory chip production in Singapore. The company ...

A US$7 billion Micron advanced packaging facility in Singapore will help manufacture high-bandwidth memory (HBM) chips in ...

The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total ...

Micron Technology is investing S$9.5 billion ($7 billion) to build an advanced chip packaging facility in Singapore as the semiconductor giant expands its capacity to cater to booming demand for ...

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore, as artificial intelligence boosts demand for advanced memory chips.

Singapore is set to solidify its position in the global semiconductor supply chain with Micron Technology’s announcement of a $7 billion investment in a high-bandwidth memory (HBM) packaging facility.

Micron marked the occasion with a ceremony attended by Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry of Singapore, Png Cheong Boon, Chairman of the Singapore The newest ...

Micron Technology is set to invest S$9.6bn ($7bn) in Singapore over several years to meet the rising demand for advanced memory chips driven by artificial intelligence (AI). The US semiconductor ...