Grand Process Technology Company (GPTC), a Taiwan-based semiconductor equipment company involved in the supply chain for TSMC ...

TSMC is rumored to build new CoWoS advanced packaging plants in the US and Japan due to 'persistently strong demand'. TSMC to ...

TSMC's 5nm and 3nm production lines are 'fully loaded' until 1H 2025 due to 'strong orders' for AI chips, Qualcomm + MediaTek ...

To put this in context, as we reported last week, Nvidia just surpassed Apple and Microsoft in terms of market cap - that ...

However, the collaboration between TSMC and Amkor will be more profound as the latter intends to offer TSMC’s CoWoS and InFo advanced packaging technologies for high-end AI, HPC, and mobile ...

A recent annual forum for the chipmaking equipment and materials sectors was hosted in Tainan, southern Taiwan, bringing ...

Nvidia has rebranded its flagship Blackwell Ultra products, in what appears to be a strategic shift at the chipmaker aimed at ...

During its recent earnings call on October 17, the chipmaker revealed that its production capacity for CoWoS packaging technology is set to double year-over-year in both 2024 and 2025. However ...

The platform supports both the TSMC CoWoS-S (silicon Interposer) and the CoWoS-R (organic interposer) advanced packaging technologies. The platform represents real-world CPU/GPU/AI/Networking chips by ...

ASE Technology Holding Co (ASE, 日月光投控), the world’s biggest chip assembly and testing manufacturing (ATM) service provider, ...

Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS® Platform with 7.2 Gbps HBM3 ...